Electronics manufacturers face rising demands for miniaturization, signal integrity, and EMC—where small errors cause big failures.
Gromax delivers precision-stamped components with tight tolerances, fine features, and shielding, providing production-ready, fully documented solutions that help OEMs and Tier 1/2 suppliers build reliable, compliant devices and accelerate time to market.
✅ Helps prevent design revisions or late-stage EMI test failures.
We collaborate with your engineers to optimize stamped components for signal integrity, EMI shielding effectiveness, and miniaturized footprints—reviewing material conductivity, plating specs, and tolerances for manufacturability.
✅ Speeds up regulatory testing and functional validation.
Accelerate product validation with production-intent prototypes for shields, contacts, terminals, or sensor inserts—enabling fit, function, and shielding validation before scaling up.
✅ Delivers tooling that achieves fine-feature tolerances for electronic components.
Our in-house die shop builds progressive dies capable of stamping thin-gauge conductive alloys (beryllium copper, phosphor bronze, stainless steel), incorporating precision coining, embossing, and formed features.
✅ Ensures critical electrical and mechanical function in dense electronic assemblies.
We achieve tolerances down to ±0.0015” with clean shearing and burr control to support electrical continuity, tight assembly stackups, and surface readiness for plating or shielding effectiveness.
✅ Reduces coordination of multiple post-stamping suppliers.
We coordinate plating (tin, nickel, silver, gold to ASTM specs), spot welding, or mechanical assembly—delivering plating-ready or partially assembled shields, contacts, or sensor housings.
✅ Ensures compliance and documentation readiness for regulated electronics.
Every component ships with full compliance documentation (PPAP, FAIR, CMM, material/plating certs, traceability), supporting IEC, UL, RoHS, and audit requirements.
We achieve tolerances down to ±0.0015” to ensure critical fit in high-density electronic assemblies.
Our stamping process controls burrs and surface finish to meet plating specs for conductivity and corrosion resistance.
We minimize burr height to protect sensitive contact interfaces and signal paths.
We stamp thin conductive alloys down to 0.002” with precision, minimizing distortion and maintaining. flatness
Every production lot is fully traceable for material, process, and compliance audits.
We deliver full documentation tailored to electronics QA, compliance, and launch milestones.
Our engineers collaborate to design inserts optimized for reliable insert molding into sensor housings.
We design progressive dies to incorporate controlled embossing and forming to prevent cracking while maintaining shield effectiveness.
We provide production-intent prototypes with expedited tooling to validate form, fit, shielding effectiveness, and plating prior to volume production.
We achieve ultra-tight tolerances and critical dimension control, verified with CMM reports, to prevent assembly misfits.
We deliver integrated plating and secondary assembly operations, reducing supplier handoffs and simplifying your supply chain.
We proactively deliver PPAP, FAIR, CMM, and material certs with every production lot—ready for your QA and compliance teams.
Upload your drawing or RFQ to request a quote for precision-stamped, compliance-ready electronic components built to your production needs.