








Stamped covers or enclosures used around electronic circuitry to help contain or reduce electromagnetic coupling between sensitive or noisy components.

Formed metal frames, lids, and covers that create conductive barriers around electronics, connectors, or subassemblies.

Stamped clips that provide electrical contact between boards, housings, panels, shields, or chassis surfaces.

Formed conductive fingers or spring elements designed to maintain contact pressure between mating conductive surfaces despite assembly variation.

Stamped tabs or straps used to establish electrical continuity between panels, enclosures, brackets, or structural members.

Repeating spring-finger features used along seams, openings, or mating surfaces to improve conductive contact and reduce gaps in a shielding path.
Shield effectiveness depends on enclosure continuity, opening size, seam design, material conductivity, and the frequency range being controlled.
Contact area, surface condition, plating, contact force, and joint design influence the resistance of grounding and bonding interfaces.
Grounding fingers and clips must provide enough normal force for reliable electrical contact without overstressing the material or damaging mating surfaces.
Conductivity, spring properties, corrosion resistance, solderability, and environmental exposure influence alloy and finish selection.
Slots, ventilation openings, panel joints, and enclosure seams can interrupt a shielding path, so their geometry and contact strategy should be considered early in the design.
Burr direction, edge quality, oxide, coatings, contamination, and plating coverage can affect both assembly fit and electrical continuity at mating surfaces.
Review the drawing, shielding or grounding function, material, contact locations, spring features, tolerances, finish, assembly method, and production volume.
Progressive Die Design & Build — Develop tooling for required blanking, piercing, lancing, embossing, coining, bending, forming, and cutoff operations.
Establish a repeatable process around shield geometry, contact-finger position, formed height, seam interfaces, and critical grounding features.
Incorporate tin, nickel, silver, or other specified finishes together with cleaning, deburring, solderable surface preparation, assembly, or other required secondary processing.
Support ongoing programs with tool maintenance, dimensional review, process monitoring, root-cause analysis, and corrective action.
Overall dimensions, formed height, wall position, cover fit, and enclosure profile.
Finger position, free height, contact location, engagement, and formed relationship to mating surfaces.
Alignment, overlap, gap condition, and fit at panel, chassis, board, or enclosure interfaces.
Burr orientation, edge condition, cleanliness, plating coverage, and specified coating thickness.
Gromax checks critical dimensions using standard measurement, fixtures, custom gaging, or functional inspection methods and reviews your certification, traceability, and inspection documentation needs.
To protect customer confidentiality and controlled technical information, Gromax does not publicly display customer-specific drawings, specifications, or sensitive part details without appropriate authorization.
Images shown are illustrative only and are used to represent the types of parts, geometries, and manufacturing capabilities Gromax supports. They do not depict specific customer designs or proprietary technical data.