
Stamped metal shields designed to contain electromagnetic emissions and protect sensitive electronics from external interference.

Precision shielding components used to reduce radio frequency interference and maintain signal integrity within electronic assemblies.

Board-level stamped enclosures that cover and protect electronic circuits, modules, and communication components from EMI/RFI exposure.

Precision-formed shields designed for direct PCB mounting to isolate sensitive electronic components and circuitry.

Stamped spring components used to establish reliable grounding paths and electrical continuity between assemblies and enclosures.

Precision spring contacts designed to maintain consistent grounding, shielding performance, and conductive engagement.

Stamped conductive contacts used to provide reliable electrical connections between antennas and electronic assemblies.

Stamped metal shells that provide shielding, grounding, and mechanical protection for connector systems and cable assemblies.

Precision clips used to secure shields, covers, and enclosures while maintaining grounding performance.

Stamped shielding components designed to protect electronics from EMI/RFI while supporting assembly and product durability.

EMI shields and grounding components protect processors, memory devices, power-management circuits, and electronic assemblies from interference.

Shielding and grounding components help maintain signal integrity and electrical performance within sensing and monitoring devices.

RF shields, shield cans, antenna contacts, and grounding components support wireless communication, networking, and data-transmission systems.

Stamped shielding components protect control boards, automation equipment, relays, and electronic interfaces operating in electrically noisy environments.

EMI/RF shielding components support infotainment systems, sensors, control modules, battery-management systems, and vehicle electronics.

Precision shielding and grounding components help protect sensitive electronics used in diagnostic, monitoring, and portable medical equipment.

Shielding components support communication systems, avionics, ruggedized electronics, and mission-critical equipment exposed to demanding environments.

Board-level shields and grounding components support compact electronic devices requiring protection from EMI/RFI interference.
Programs requiring precise dimensional control, repeatable fit, and consistent assembly performance.
Applications where shield seating, PCB mounting, and grounding performance depend on controlled flatness and coplanarity.
Components requiring consistent electrical continuity and reliable grounding throughout the product lifecycle.
Parts requiring controlled spring force, deflection, retention, and repeatable electrical contact behavior.
Experience working with stainless steel, nickel silver, copper alloys, brass, and other materials commonly specified for shielding and grounding applications.
Programs where edge condition and burr orientation can impact grounding effectiveness, assembly fit, or operator safety.
Experience supporting tin, nickel, silver, gold, and RoHS-compliant finishes used to enhance conductivity, corrosion resistance, and shielding performance.
Components requiring intricate forms, tabs, contact fingers, lances, embossments, and shield features while maintaining dimensional stability.
Production-volume programs where repeatability, throughput, tooling stability, and long-term process consistency are critical.
Programs requiring tapping, hardware insertion, plating, assembly, packaging, or integration into larger electronic subassemblies.
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Images shown are illustrative only and are used to represent Gromax’s design and manufacturing capabilities. They do not contain proprietary, controlled, or export-restricted information.