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Electronics & Sensors
Engineered for Signal Integrity. Built for Miniaturization.
Precision in electronic assemblies isn’t optional—it’s what separates clean signals from noise. When thin features distort, plating varies, or solder joints shift in reflow, small deviations turn into big failures.
At Gromax, DFM, tooling, stamping, and gaging sit under one roof. We engineer contacts, terminals, and shields for real conditions—controlling form, finish, and function from coined EMI shields to micro terminals—so parts run right through final build.
Production-Ready Stamped Parts
Production-ready components engineered for signal integrity, dimensional precision, and EMI compliance.
Board-to-Board & Wire-to-Board Signal Terminals
Provide reliable low-level signal and low/medium current paths in connectors, headers, terminal blocks, and sensor modules.
RF/EMI Shield Cans & Frames
Reduce radiated/conducted emissions and susceptibility for radios, SoCs, PMICs, and sensitive analog front ends.
IC/Sensor Leadframes
Provide the mechanical die attach and electrical fan-out from silicon to the PCB in analog, MEMS, power, and mixed-signal packages.
Press-Fit / Compliant Pins & Blades
Solderless or mixed-tech interconnects into plated through-holes for rugged modules and serviceable assemblies.
Grounding & Antenna Spring Contacts
Create compliant chassis/RF grounds and low-profile antenna contacts in handhelds, wearables, and compact sensor nodes.
Connector Shells & Shield Cages
Provide mechanical robustness, EMI containment, and latching geometry for high-speed I/O and modular jacks.
How We Add Value
Fine-Pitch Repeatability
±0.0015″ features, tight true-position, and SMT coplanarity control for 0.50–1.27 mm pitches on terminals and leadframes.
Signal & RF-Ready Surfaces
Selective Ni/Pd/Au, Ag, and Sn with controlled roughness and burr direction to cut fretting, contact resistance, and noise.
EMI/EMC Hardware That Fits
Coined, ultra-flat shields and frames with pick-and-place features, venting, and removable lids that stay planarity-true through reflow.
Press-Fit & SMT Integration
Compliant pins and blades tuned for insertion/retention, board-lock geometry, and reflow-stable springs for rugged, solderless or hybrid joints.
Mold/Overmold Ready Strips
Leadframes and contacts designed with downsets, tie-bar strategy, and carrier control for clean transfer into insert/transfer molds.
Quality You Can Prove
GR&R ≤10% on CTQs, inline vision and in-die sensing, plating microsections, and full PPAP/FAI traceability from first hit to shipment.
Frequently Asked Questions (FAQ)
What size or thickness range can you run?
Typical: 0.003″–0.050″ (geometry-dependent); call for outliers.
Do you manage plating and reel-to-reel finishing?
Yes. We coordinate reel-to-reel plating and finish control with approved partners.
How do you verify dimensional capability on miniature parts?
We use custom GR&R-backed gaging for thin, coined, or reflective features that challenge CMMs.
Do you help with redesign for manufacturability?
Yes — DFM markups identify features at risk for distortion or solder failure before tooling begins.
Engineer Your Next Electronic Breakthrough
Upload your drawing or RFQ to request a quote for precision-stamped, compliance-ready electronic components built to your production needs.