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Molding Integrated Applications
Insert & Overmold-Ready Metal Components.
Insert-mold and overmold programs fail fast when stampings aren’t stable. If carriers twist, parts warp in plating, or datums shift under injection pressure, the mold stack misaligns—causing flash, scrap, and sensor misreads.
Gromax loops in molding and automation early—before steel is cut. We design carriers, pitch, and datums to your mold and plating windows so inserts load cleanly, seat properly, and hold spec shot after shot.
Ready for Insert & Overmold
Progressive-die carriers with tie-bar strategy, downsets, and plating windows that survive clamp, heat, and flow.
Insert-Molded Terminals & Blades
Create robust electrical paths molded into thermoplastic housings for connectors, switches, and sensor bodies; eliminate secondary assembly.
Overmold-Ready Leadframes
Provide the electrical fan-out and mechanical skeleton inside overmolded sensor/connector packages; supports pick-and-place and singulation.
Insert-Moldable Press-Fit / Compliant Pins
Enable solderless or hybrid connections from a molded module into a PCB backplane while locking pins in the plastic body.
Mold-In Ground Tabs & Shield Frames
Provide chassis/PE ground and EMI containment integrated into plastic housings for modules and sensor covers.
Overmolded Busbars & Power Links
Encapsulated low-impedance conductors inside connector bodies, power modules, EV subsystems, and compact controllers for creepage/clearance control.
Mold-Integrated Latches, Springs & Retention Clips
Provide repeatable snap-fits and actuation forces molded directly into housings for modules, cartridges, and covers.
How We Add Value
Early Mold/Automation Co-Design
We align carriers, pitches, and datums to your tool, gate, and handling plan before steel is cut.
Mold-Ready Carriers
Anti-twist ribs, pilot control, and break tabs placed off critical faces for stable pick, place, and ejection.
Bond & Seal Integrity
Defined Ra on bond lands, Ni-only or mask-kept unplated zones, and seal flats coined for flash control.
Dimensional Stability Through Plating & Flow
Coin/pre-form sequencing and datum strategy that resists warp under clamp pressure and resin shrink.
Integrated Interconnects
Insert-moldable terminals, compliant pins, and ground frames with mold-locks/undercuts for strong retention.
Proven & Documented
GR&R-backed CTQs, plating microsections, peel/pull and short-shot trials, with full PPAP/FAI traceability.
Frequently Asked Questions (FAQ)
Do you coordinate with molders or plating partners?
Yes — we collaborate directly with your molders and platers to define carrier pitch, datum locations, and handling methods.
Can you support reel-to-reel overmold applications?
Absolutely. Our tooling and carriers are designed for continuous reel-to-reel automation.
Do you control plating adhesion and finish thickness?
Yes. We review finish specs and validate adhesion during DFM and prototype runs.
What documentation comes with release?
Marked DFM PDFs, carrier concept drawings, capability data, FAIR/PPAP, and inspection correlation reports.
Engineer Your Next Molding
Upload your drawing or RFQ for precision-stamped, mold-ready inserts built to your production needs.